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WL 2 in1 CPU NAND BGA Reballing Stencil Platfrom for iPhone 6/6S/7/8/X/XR/XS/XsMax
20402
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WL 2 in1 CPU NAND BGA Reballing Stencil Platfrom for iPhone 6/6S/7/8/X/XR/XS/XsMax
Description:
When you purchase this product for the first time, you must first purchase the magnetic base
Magnetic base + positioning plate + tin mesh （Together to use,）
0.1-0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing Solder working,
it is the top quality BGA Reballing Stencil for iphone CPU and NAND, A9 / A8 /A10/A11/A12
WL Top quality Fast Speed BGA reballing Solder template stencil
Optional Positioning Plate (Black): Not univeral, can't working with different BGA Reballing Stencil,
need the right model BGA Reballing Stencil, the Black Positioning Plate just match with the right BGA Reballing Stencil.
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